Stress relief die implementation

Embodiments disclosed herein include semiconductor packages. In a particular embodiment, the semiconductor package is a wafer level chip scale package (WLCSP). In an embodiment, the WLCSP comprises a die. In an embodiment, the die comprises an active surface and a backside surface. The die has a fir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Stoeckl, Stephan, Seidemann, Georg, Waidhas, Bernd, Molzer, Wolfgang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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