Vacuum modulated two phase cooling loop efficiency and parallelism enhancement

Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid res...

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Bibliographische Detailangaben
Hauptverfasser:	Shia, David, Diglio, Paul, Tadayon, Pooya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.