Wafer-tilt determination for slice-and-image process
A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Klochkov, Dmitry Korb, Thomas Huynh, Chuong |
| description | A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12056865B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12056865B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12056865B23</originalsourceid><addsrcrecordid>eNrjZDAJT0xLLdItycwpUUhJLUktys3MSyzJzM9TSMsvUijOyUxO1U3MS9HNzE1MT1UoKMpPTi0u5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhkYGpmYWZqZORsbEqAEAPV4tCQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer-tilt determination for slice-and-image process</title><source>esp@cenet</source><creator>Klochkov, Dmitry ; Korb, Thomas ; Huynh, Chuong</creator><creatorcontrib>Klochkov, Dmitry ; Korb, Thomas ; Huynh, Chuong</creatorcontrib><description>A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; COUNTING ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PHYSICS ; REGULATING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240806&DB=EPODOC&CC=US&NR=12056865B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240806&DB=EPODOC&CC=US&NR=12056865B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Klochkov, Dmitry</creatorcontrib><creatorcontrib>Korb, Thomas</creatorcontrib><creatorcontrib>Huynh, Chuong</creatorcontrib><title>Wafer-tilt determination for slice-and-image process</title><description>A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>CONTROL OR REGULATING SYSTEMS IN GENERAL</subject><subject>CONTROLLING</subject><subject>COUNTING</subject><subject>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</subject><subject>PHYSICS</subject><subject>REGULATING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJT0xLLdItycwpUUhJLUktys3MSyzJzM9TSMsvUijOyUxO1U3MS9HNzE1MT1UoKMpPTi0u5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhkYGpmYWZqZORsbEqAEAPV4tCQ</recordid><startdate>20240806</startdate><enddate>20240806</enddate><creator>Klochkov, Dmitry</creator><creator>Korb, Thomas</creator><creator>Huynh, Chuong</creator><scope>EVB</scope></search><sort><creationdate>20240806</creationdate><title>Wafer-tilt determination for slice-and-image process</title><author>Klochkov, Dmitry ; Korb, Thomas ; Huynh, Chuong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12056865B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>CONTROL OR REGULATING SYSTEMS IN GENERAL</topic><topic>CONTROLLING</topic><topic>COUNTING</topic><topic>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</topic><topic>PHYSICS</topic><topic>REGULATING</topic><toplevel>online_resources</toplevel><creatorcontrib>Klochkov, Dmitry</creatorcontrib><creatorcontrib>Korb, Thomas</creatorcontrib><creatorcontrib>Huynh, Chuong</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Klochkov, Dmitry</au><au>Korb, Thomas</au><au>Huynh, Chuong</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer-tilt determination for slice-and-image process</title><date>2024-08-06</date><risdate>2024</risdate><abstract>A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US12056865B2 |
| source | esp@cenet |
| subjects | CALCULATING COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING FUNCTIONAL ELEMENTS OF SUCH SYSTEMS IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING |
| title | Wafer-tilt determination for slice-and-image process |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T08%3A05%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Klochkov,%20Dmitry&rft.date=2024-08-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12056865B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |