Wafer-tilt determination for slice-and-image process

A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.

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Bibliographische Detailangaben
Hauptverfasser:	Klochkov, Dmitry, Korb, Thomas, Huynh, Chuong
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING FUNCTIONAL ELEMENTS OF SUCH SYSTEMS IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING
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Beschreibung
Zusammenfassung:	A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.