Surface projection polishing pad

Surface projection polishing pad

An article includes a surface layer and a base layer coupled to at least a portion of the surface layer. The surface layer includes a top major surface defining a plane and a bottom major surface opposite the top major surface. A plurality of projections extends from the plane of the top major surfa...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tan, Lian S, Lerbakken, Justin W, Coad, Eric C
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:An article includes a surface layer and a base layer coupled to at least a portion of the surface layer. The surface layer includes a top major surface defining a plane and a bottom major surface opposite the top major surface. A plurality of projections extends from the plane of the top major surface and a plurality of microstructures extend from the plurality of projections.