Imprinted emboss in chip-on-film

An information handling system display may include a display panel cell, a mold frame, and a chip-on-film. The chip-on-film may be coupled to the display panel cell. The chip-on-film may include one or more protrusions. A first portion of the chip-on-film may be adjacent to the one or more protrusio...

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Bibliographische Detailangaben
Hauptverfasser:	Oh, Guentaek, Lee, BongJun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CUTTING CUTTING-OUT DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING HAND CUTTING TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORATING PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PUNCHING SEMICONDUCTOR DEVICES SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	An information handling system display may include a display panel cell, a mold frame, and a chip-on-film. The chip-on-film may be coupled to the display panel cell. The chip-on-film may include one or more protrusions. A first portion of the chip-on-film may be adjacent to the one or more protrusions across a width of a first surface of the chip-on-film. The one or more protrusions may be in contact with a mold frame of the display. The first portion of the chip-on-film adjacent to the one or more protrusions may not be in contact with the mold frame of the display.