Bonding through multi-shot laser reflow
A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first la...
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| creator | Pei, Hao-Jan Chen, Wei-Yu Yu, Chen-Hua Hsieh, Ching-Hua Cheng, Chia-Shen Chung, Philip Yu-Shuan Huang, Kuei-Wei Tsai, Yu-Peng Lin, Hsiu-Jen Liu, Chung-Shi |
| description | A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Bonding through multi-shot laser reflow |
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