Bonding through multi-shot laser reflow

Bonding through multi-shot laser reflow

A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first la...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Pei, Hao-Jan, Chen, Wei-Yu, Yu, Chen-Hua, Hsieh, Ching-Hua, Cheng, Chia-Shen, Chung, Philip Yu-Shuan, Huang, Kuei-Wei, Tsai, Yu-Peng, Lin, Hsiu-Jen, Liu, Chung-Shi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.