Polishing slurry composition and method for producing same

The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant in...

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Bibliographische Detailangaben
Hauptverfasser: Park, Kwang Soo, Choi, Nak Hyun, Hwang, Jun Ha, Choi, Soo Wan
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant including a nonionic linear polymer; and a second dispersant including an anionic coiling polymer, wherein the polishing slurry composition satisfies the following Expressions 1 and 2: [Expression 1] 4≤log(milling energy)