Injection molding apparatus with a thermal bridge

An injection molding apparatus and hot runner system are disclosed. The injection molding apparatus includes a plurality of mold plates in which the hot runner system is received. A manifold receives molding material and has a manifold channel that extends between an inlet and an outlet. A nozzle delivers moldable material to a mold cavity. The nozzle has a nozzle channel in fluid communication between the manifold channel and the mold cavity. A valve pin seal is located at the upstream end of the nozzle, and a valve pin that is connected to an actuator extends through the manifold and nozzle is slidably received in the valve pin seal. The hot runner system further includes a thermal bridge that is in conductive thermal communication with the valve pin seal and a cooled one of the plurality of mold plates.