Rotating lid for module cooler

Rotating lid for module cooler

An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Brodsky, William L, Singer, Noah, Canfield, Shawn, Yu, Yuet-Ying, Zitz, Jeffrey Allen, Torok, John, Schultz, Mark D
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Brodsky, William L
Singer, Noah
Canfield, Shawn
Yu, Yuet-Ying
Zitz, Jeffrey Allen
Torok, John
Schultz, Mark D
description An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12028997B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12028997B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12028997B23</originalsourceid><addsrcrecordid>eNrjZJALyi9JLMnMS1fIyUxRSMsvUsjNTynNSVVIzs_PSS3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGRgZGFpaW5k5GxsSoAQDvziSX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Rotating lid for module cooler</title><source>esp@cenet</source><creator>Brodsky, William L ; Singer, Noah ; Canfield, Shawn ; Yu, Yuet-Ying ; Zitz, Jeffrey Allen ; Torok, John ; Schultz, Mark D</creator><creatorcontrib>Brodsky, William L ; Singer, Noah ; Canfield, Shawn ; Yu, Yuet-Ying ; Zitz, Jeffrey Allen ; Torok, John ; Schultz, Mark D</creatorcontrib><description>An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240702&amp;DB=EPODOC&amp;CC=US&amp;NR=12028997B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240702&amp;DB=EPODOC&amp;CC=US&amp;NR=12028997B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Brodsky, William L</creatorcontrib><creatorcontrib>Singer, Noah</creatorcontrib><creatorcontrib>Canfield, Shawn</creatorcontrib><creatorcontrib>Yu, Yuet-Ying</creatorcontrib><creatorcontrib>Zitz, Jeffrey Allen</creatorcontrib><creatorcontrib>Torok, John</creatorcontrib><creatorcontrib>Schultz, Mark D</creatorcontrib><title>Rotating lid for module cooler</title><description>An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALyi9JLMnMS1fIyUxRSMsvUsjNTynNSVVIzs_PSS3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGRgZGFpaW5k5GxsSoAQDvziSX</recordid><startdate>20240702</startdate><enddate>20240702</enddate><creator>Brodsky, William L</creator><creator>Singer, Noah</creator><creator>Canfield, Shawn</creator><creator>Yu, Yuet-Ying</creator><creator>Zitz, Jeffrey Allen</creator><creator>Torok, John</creator><creator>Schultz, Mark D</creator><scope>EVB</scope></search><sort><creationdate>20240702</creationdate><title>Rotating lid for module cooler</title><author>Brodsky, William L ; Singer, Noah ; Canfield, Shawn ; Yu, Yuet-Ying ; Zitz, Jeffrey Allen ; Torok, John ; Schultz, Mark D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12028997B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Brodsky, William L</creatorcontrib><creatorcontrib>Singer, Noah</creatorcontrib><creatorcontrib>Canfield, Shawn</creatorcontrib><creatorcontrib>Yu, Yuet-Ying</creatorcontrib><creatorcontrib>Zitz, Jeffrey Allen</creatorcontrib><creatorcontrib>Torok, John</creatorcontrib><creatorcontrib>Schultz, Mark D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Brodsky, William L</au><au>Singer, Noah</au><au>Canfield, Shawn</au><au>Yu, Yuet-Ying</au><au>Zitz, Jeffrey Allen</au><au>Torok, John</au><au>Schultz, Mark D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Rotating lid for module cooler</title><date>2024-07-02</date><risdate>2024</risdate><abstract>An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US12028997B2
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Rotating lid for module cooler
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T20%3A08%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Brodsky,%20William%20L&rft.date=2024-07-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12028997B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true