Rotating lid for module cooler

Rotating lid for module cooler

An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Brodsky, William L, Singer, Noah, Canfield, Shawn, Yu, Yuet-Ying, Zitz, Jeffrey Allen, Torok, John, Schultz, Mark D
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.