Molded hockey puck with electronic signal transmitter core

A hockey puck is formed as two mating subcomponents encapsulating an internal signal transmitter. The hockey puck includes holes extending from an external surface of the hockey puck into an internal void formed between the two mating subcomponents. The internal signal transmitter includes protrusions extending into the holes, each including a surface-mounted diode. The surface-mounted diodes include no lens cap, allowing the diodes to be positioned closer to the external surface of the puck than existing pucks. For improved visibility, the diode is positioned less than 5 mm from the external surface of the puck, but greater than 1 mm from the external surface of the puck, in order to prevent the diodes from being externally visible. Preferably, the diodes are positioned between approximately 2 mm and approximately 3 mm from the external surface of the hockey puck.