Power supply apparatus
Power supply apparatus (10) comprising a circuit board (11) and one or more power devices (12) attached to a first surface (11a) of the circuit board (11). A plate (14a) composed of a thermally conductive plastic faces the first surface of the circuit board (11). A thermally conductive encapsulant (...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Power supply apparatus (10) comprising a circuit board (11) and one or more power devices (12) attached to a first surface (11a) of the circuit board (11). A plate (14a) composed of a thermally conductive plastic faces the first surface of the circuit board (11). A thermally conductive encapsulant (15) is provided between the first surfaces (11a) of the circuit board (11) and the plate (14a). The circuit board (11) comprises one or more heat-spreading layers (212*,213*) configured to enhance heat transfer in directions parallel to the first surface (11a) of the circuit board (11). The first surface (14aa″) of the plate (14a) may also be irregular and comprises one or more first regions (32) and one or more second regions (31) that are further from the first surface (11a) of the circuit board (11) than the one or more first regions (32), with the one or more power devices (12) being aligned with the one or more second regions (31). |
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