Robot gripper for moving wafer carriers and packing materials and method of operating the same

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configur...

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Bibliographische Detailangaben
Hauptverfasser:	Chen, Chi-Wei, Lee, Chien-Fa, Hung, Fu-Cheng, Wu, Feng-Kuang, Chen, Chih-Hua
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS MANIPULATORS PACKING PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES STORING TRANSPORTING UNPACKING
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Beschreibung
Zusammenfassung:	A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.