Package comprising an integrated passive device configured as a cap for a filter

Package comprising an integrated passive device configured as a cap for a filter

A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The...

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Hauptverfasser: Yun, Changhan Hobie, Kim, Daniel Daeik, Thadesar, Paragkumar Ajaybhai, Park, Nosun, Vadhavkar, Sameer Sunil
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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creator Yun, Changhan Hobie
Kim, Daniel Daeik
Thadesar, Paragkumar Ajaybhai
Park, Nosun
Vadhavkar, Sameer Sunil
description A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device.
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subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title Package comprising an integrated passive device configured as a cap for a filter
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