Package comprising an integrated passive device configured as a cap for a filter

A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Yun, Changhan Hobie, Kim, Daniel Daeik, Thadesar, Paragkumar Ajaybhai, Park, Nosun, Vadhavkar, Sameer Sunil
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device.