Semiconductor package having an electrically insulating core with exposed glass fibres

A semiconductor package includes: an electrically insulating core and an electrically conductive first via extending through a periphery region of the core, the core having glass fibres interwoven with epoxy material and one or more regions where the glass fibres are exposed from the epoxy material; a power semiconductor die embedded in an opening in the core and having a first load terminal bond pad which faces a same direction as a first side of the core, a second load terminal bond pad which faces a same direction as a second side of the core, and a control terminal bond pad; a resin that encases the power semiconductor die; a first contact pad plated on the first via at the second side of the core; and a second contact pad plated on the first load terminal bond pad of the power semiconductor die at the first side of the core.