Method of testing wafer

Method of testing wafer

A method includes following steps. An image of a wafer is captured. A first contact region in the captured image at which the first conductive contact is rendered is identified. A second contact region in the captured image at which the second conductive contact is rendered is identified. The second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hsu, Yung-Lung, Tseng, Chia-Yi, Lin, Chih-Hsun, Chuang, Kun-Tsang, Ho, Yen-Hsung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes following steps. An image of a wafer is captured. A first contact region in the captured image at which the first conductive contact is rendered is identified. A second contact region in the captured image at which the second conductive contact is rendered is identified. The second conductive contact is determined as not shorted to the first conductive contact, in response to the identified second contact region in the captured image is darker than the identified first contact region in the captured image.