Shielded integrated device packages

Shielded integrated device packages

An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radia...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kudtarkar, Santosh Anil, Downey, Mark, Venkatadri, Vikram
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASUREMENT OF NUCLEAR OR X-RADIATION
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.