Semiconductor device having a passivation layer and method of making

A semiconductor device includes a conductive pad over an interconnect structure, wherein the conductive pad is electrically connected to an active device. The semiconductor device further includes a dielectric layer over the conductive pad, wherein the dielectric layer has a first conformity. The se...

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Bibliographische Detailangaben
Hauptverfasser: Shih, Yu-Lung, Chang, C. C, Li, Chao-Keng, Kuo, Alan, Lin, Yi-An
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device includes a conductive pad over an interconnect structure, wherein the conductive pad is electrically connected to an active device. The semiconductor device further includes a dielectric layer over the conductive pad, wherein the dielectric layer has a first conformity. The semiconductor device further includes a passivation layer over the dielectric layer, wherein the passivation layer has a second conformity different from the first conformity.