Electronic carrier and method of manufacturing the same

Electronic carrier and method of manufacturing the same

An electronic carrier and a method of manufacturing an electronic carrier are provided. The electronic carrier includes a first interconnection structure and a second interconnection structure. The first interconnection structure includes a first patterned conductive layer having a first pattern den...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yen, You-Lung, Appelt, Bernd Karl
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic carrier and a method of manufacturing an electronic carrier are provided. The electronic carrier includes a first interconnection structure and a second interconnection structure. The first interconnection structure includes a first patterned conductive layer having a first pattern density. The second interconnection structure is laminated to the first interconnection structure and includes a second patterned conductive layer having a second pattern density higher than the first pattern density. The first interconnection structure is electrically coupled to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure.