Processing chamber condition and process state monitoring using optical reflector attached to processing chamber liner

A method includes receiving light, by a light coupling device and along an optical path, reflected back from a reflector mounted on a liner of a processing chamber. The method further includes detecting, by a spectrometer within the received light, a first spectrum representative of a deposited film...

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Bibliographische Detailangaben
1. Verfasser:	Tae, Patrick
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING
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Beschreibung
Zusammenfassung:	A method includes receiving light, by a light coupling device and along an optical path, reflected back from a reflector mounted on a liner of a processing chamber. The method further includes detecting, by a spectrometer within the received light, a first spectrum representative of a deposited film layer on the reflector. The method further includes aligning, using an alignment device, the light coupling device in two dimensions with reference to the reflector along the optical path until maximization of the light received by the light coupling device.