Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same

The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. The thermoplastic resin composition includes a first propylene-ethylene copolymer, a second propylene-ethylene copolymer, a thermoplastic elastomer, an inorganic filler, and a sodium-phosphate-based nucleating agent as appropriate, and thus a molded article produced therefrom can exhibit improved mechanical rigidity, impact resistance, and dimensional stability. Even when formed to a low thickness for weight reduction, the molded article can be imparted with excellent processability, high tensile strength, a high flexural modulus, and high impact strength.