Technique to improve waterproofness and dust resistance for circuit board in job-site gear

A job-site gear in one aspect of the present disclosure includes a circuit board, at least one electronic component, and a resin member. A first surface of the circuit board includes a first area, a second area, and a third area. The third area is located in a boundary between the first area and the...

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Bibliographische Detailangaben
1. Verfasser:	Hozumi, Akihiro
Format:	Patent
Sprache:	eng
Schlagworte:	AGRICULTURE ANIMAL HUSBANDRY BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COFFEE MILLS CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPSOR SEAWEED DOMESTIC ARTICLES OR APPLIANCES DOMESTIC WASHING OR CLEANING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS FISHING FORESTRY FRAMES, CASINGS, OR BEDS OF ENGINES OR OTHER MACHINES ORAPPARATUS NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUSPROVIDED FOR ELSEWHERE FURNITURE GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HARVESTING HEATING HORTICULTURE HUMAN NECESSITIES HUNTING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING MOWING PRINTED CIRCUITS SPICE MILLS STANDS OR SUPPORTS SUCTION CLEANERS IN GENERAL THERMAL INSULATION IN GENERAL TRAPPING WATERING WEAPONS
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Beschreibung
Zusammenfassung:	A job-site gear in one aspect of the present disclosure includes a circuit board, at least one electronic component, and a resin member. A first surface of the circuit board includes a first area, a second area, and a third area. The third area is located in a boundary between the first area and the second area. A second surface of the circuit board includes a fourth area, a fifth area, and a sixth area located behind the first area, the second area, and the third area, respectively. The third area and the sixth area include at least one slit penetrating through the circuit board. The resin member is integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component on the first area.