Heterogeneous antenna in fan-out package

A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chuang, Po-Yao, Tsai, Po-Hao, Jeng, Shin-Puu
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.