Chip package structure with buffer structure and method for forming the same

A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a seco...

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Bibliographische Detailangaben

Hauptverfasser:	Lin, Yu-Sheng, Yang, Che-Chia, Chen, Ping-Tai, Lai, Po-Chen, Wang, Chin-Hua, Lin, Po-Yao, Jeng, Shin-Puu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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