Systems and methods for evacuated injection repair of bondline voids
In an example, a method is described. The method comprises forming a single hole into a bond gap repair area. The method also comprises evacuating, via an adhesive injection apparatus attached to the single hole, the bond gap repair area and an injection channel of the adhesive injection apparatus....
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Zusammenfassung: | In an example, a method is described. The method comprises forming a single hole into a bond gap repair area. The method also comprises evacuating, via an adhesive injection apparatus attached to the single hole, the bond gap repair area and an injection channel of the adhesive injection apparatus. The method also comprises forcing adhesive through the evacuated injection channel and into the evacuated bond gap repair area. |
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