Integrated abrasive polishing pads and manufacturing methods

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of...

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Bibliographische Detailangaben
Hauptverfasser:	Cornejo, Mario Dagio, Ganapathiappan, Sivapackia, Bajaj, Rajeev, Redfield, Daniel, Patibandla, Nag B, Sinha, Amritanshu, Chockalingam, Ashwin, Arnepalli, Ranga Rao, Zhao, Yan, Fu, Boyi, Redeker, Fred C, Kumar, Ashavani
Format:	Patent
Sprache:	eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.