Manufacturing method for semiconductor structure and semiconductor structure

The present disclosure provides a manufacturing method for semiconductor structure and a semiconductor structure. The manufacturing method includes: providing a substrate; forming first mask patterns and first mask openings on the substrate, the first mask opening being located between the adjacent...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Chen, Enhao
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure provides a manufacturing method for semiconductor structure and a semiconductor structure. The manufacturing method includes: providing a substrate; forming first mask patterns and first mask openings on the substrate, the first mask opening being located between the adjacent first mask patterns; forming second mask patterns and second mask openings on the first mask patterns and the first mask openings, the second mask opening being located between the adjacent second mask patterns; and forming first patterns and first openings on the substrate based on the first mask patterns, the first mask openings, the second mask patterns and the second mask openings.