Electronic power unit and semiconductor power module

An electronic power unit has a substrate with a perpendicular direction and a flat insulating molded body has a metal layer on a first main face and conductor tracks on a second main face. The substrate is in a non-positive locking or materially-bonded manner on a base plate of the electronic power...

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Bibliographische Detailangaben
Hauptverfasser: Hopfe, Stefan, Cardi, Valeriano, Obermaier, Werner, Muscolino, Maurilio Giovannantonio, Santoro, Matteo
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An electronic power unit has a substrate with a perpendicular direction and a flat insulating molded body has a metal layer on a first main face and conductor tracks on a second main face. The substrate is in a non-positive locking or materially-bonded manner on a base plate of the electronic power unit. A first fastening device is on the base plate in a non-positive locking manner on a cooling device or a housing section has a second fastening device provided to arrange the substrate in a non-positive locking manner on a cooling device.