Method for making photochromic contact lenses

Described herein is a method for producing photochromic silicone hydrogel contact lenses in a relatively efficient and consistent manner from a polymerizable composition under a controlled thermal curing scheme. The main polymerizable components in the polymerizable composition are a high radical-re...

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Bibliographische Detailangaben
Hauptverfasser:	Wu, Daqing, Chang, Yuan, Zhang, Steve Yun, Plavnik, Michelle, Kumi, Augustine Twum, Ge, Junhao
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON CONTACT LENSES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SPECTACLES SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Described herein is a method for producing photochromic silicone hydrogel contact lenses in a relatively efficient and consistent manner from a polymerizable composition under a controlled thermal curing scheme. The main polymerizable components in the polymerizable composition are a high radical-reactive hydrophilic (meth)acrylamido monomer, a high radical-reactive siloxane-containing (meth)acrylamido monomer, and a polysiloxane vinylic crosslinker(s) free of low-reactive ethylenically unsaturated group as the main crosslinker. The thermal free radical initiator having a 10 hour half-life temperature (T10hλ) of from about 50° C. to about 90° C. The controlled thermal curing scheme includes maintaining a first curing temperature of from about (T10hλ−20)° C. to about T10hλ° C. for a first curing time and maintaining a second curing temperature of from about (T10hλ+10)° C. to about (T10hλ+35)° C. for a second curing time.