Laser edge welding of copper substrates

A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding proces...

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Bibliographische Detailangaben
Hauptverfasser: Wexler, Arnon, Ryan, Emily Ann, Hetrick, Elizabeth Therese
Format: Patent
Sprache:eng
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Zusammenfassung:A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrates with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.