Hybrid thermosyphon with immersion cooled evaporator

A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volum...

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Hauptverfasser: Harfman Todorovic, Maja, Thiagarajan, Naveenan, Schelenz, Owen Jannis Samuel, De, Anindya Kanti
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creator Harfman Todorovic, Maja
Thiagarajan, Naveenan
Schelenz, Owen Jannis Samuel
De, Anindya Kanti
description A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11943904B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11943904B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11943904B23</originalsourceid><addsrcrecordid>eNrjZDDxqEwqykxRKMlILcrNL64syMjPUyjPLMlQyMzNTS0qzgRyk_Pzc1JTFFLLEgvyixJL8ot4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChoaWJsaWBiZORMTFqAJEvLcc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Hybrid thermosyphon with immersion cooled evaporator</title><source>esp@cenet</source><creator>Harfman Todorovic, Maja ; Thiagarajan, Naveenan ; Schelenz, Owen Jannis Samuel ; De, Anindya Kanti</creator><creatorcontrib>Harfman Todorovic, Maja ; Thiagarajan, Naveenan ; Schelenz, Owen Jannis Samuel ; De, Anindya Kanti</creatorcontrib><description>A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240326&amp;DB=EPODOC&amp;CC=US&amp;NR=11943904B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240326&amp;DB=EPODOC&amp;CC=US&amp;NR=11943904B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Harfman Todorovic, Maja</creatorcontrib><creatorcontrib>Thiagarajan, Naveenan</creatorcontrib><creatorcontrib>Schelenz, Owen Jannis Samuel</creatorcontrib><creatorcontrib>De, Anindya Kanti</creatorcontrib><title>Hybrid thermosyphon with immersion cooled evaporator</title><description>A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxqEwqykxRKMlILcrNL64syMjPUyjPLMlQyMzNTS0qzgRyk_Pzc1JTFFLLEgvyixJL8ot4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChoaWJsaWBiZORMTFqAJEvLcc</recordid><startdate>20240326</startdate><enddate>20240326</enddate><creator>Harfman Todorovic, Maja</creator><creator>Thiagarajan, Naveenan</creator><creator>Schelenz, Owen Jannis Samuel</creator><creator>De, Anindya Kanti</creator><scope>EVB</scope></search><sort><creationdate>20240326</creationdate><title>Hybrid thermosyphon with immersion cooled evaporator</title><author>Harfman Todorovic, Maja ; Thiagarajan, Naveenan ; Schelenz, Owen Jannis Samuel ; De, Anindya Kanti</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11943904B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Harfman Todorovic, Maja</creatorcontrib><creatorcontrib>Thiagarajan, Naveenan</creatorcontrib><creatorcontrib>Schelenz, Owen Jannis Samuel</creatorcontrib><creatorcontrib>De, Anindya Kanti</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Harfman Todorovic, Maja</au><au>Thiagarajan, Naveenan</au><au>Schelenz, Owen Jannis Samuel</au><au>De, Anindya Kanti</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Hybrid thermosyphon with immersion cooled evaporator</title><date>2024-03-26</date><risdate>2024</risdate><abstract>A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.</abstract><oa>free_for_read</oa></addata></record>
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subjects CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
title Hybrid thermosyphon with immersion cooled evaporator
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