Hybrid thermosyphon with immersion cooled evaporator

A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volum...

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Bibliographische Detailangaben
Hauptverfasser:	Harfman Todorovic, Maja, Thiagarajan, Naveenan, Schelenz, Owen Jannis Samuel, De, Anindya Kanti
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.