Silver sintering preparation and the use thereof for the connecting of electronic components

Silver sintering preparation and the use thereof for the connecting of electronic components

A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of orga...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Chew, Ly M, Berube, Gregory, Suh, Seigi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASTING
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING METALLIC POWDER
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula CnH2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.