Forming electrical interconnections using capillary microfluidics

A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillar...

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Bibliographische Detailangaben
Hauptverfasser: Mahajan, Ankit, Pekurovsky, Mikhail L, Meyers, Kara A, Niccum, Kayla C, Walker, Christopher G, Shah, Saagar A
Format: Patent
Sprache:eng
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Zusammenfassung:A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.