Output-integrated transistor amplifier device packages incorporating internal connections

A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor...

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Bibliographische Detailangaben
Hauptverfasser: Mu, Qianli, Fisher, Jeremy, Chang, Jonathan, Noori, Basim, Marbell, Marvin, Jang, Haedong, LeFevre, Michael
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.