Copper plating solution and negative electrode composite current collector prepared using same

Copper plating solution and negative electrode composite current collector prepared using same

This application provides a copper plating solution for a composite current collector, including a leveling agent represented by a general formula (1)where an anion X is F−, Cl−, or Br−;R1, R2, and R3 are each independently selected from O or S; andR4, R5, and R6 are each independently selected from...

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Bibliographische Detailangaben
Hauptverfasser: Li, Mingling, Liu, Xin, Huang, Qisen, Peng, Jia
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:This application provides a copper plating solution for a composite current collector, including a leveling agent represented by a general formula (1)where an anion X is F−, Cl−, or Br−;R1, R2, and R3 are each independently selected from O or S; andR4, R5, and R6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl.