Diamine compound, and polyimide precursor and polyimide film using same

Disclosed is a novel diamine compound in which an imide ring is directly bonded to a (hetero)aryl ring in a molecule, and a polyimide film prepared by polymerizing the novel diamine compound exhibits improved thermal properties and storage stability.

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Bibliographische Detailangaben
Hauptverfasser:	Song, Cheol Jun, Park, Jinyoung, Kim, Minju, Lee, Hoyong
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed is a novel diamine compound in which an imide ring is directly bonded to a (hetero)aryl ring in a molecule, and a polyimide film prepared by polymerizing the novel diamine compound exhibits improved thermal properties and storage stability.