Sealing compositions for water soluble films and methods of using

A sealing composition for use in unit dose packages is provided, including: 70 to 98 wt % water; 1 to 30 wt % of a hydrogen bonding component; and 1 to 30 wt % of a complex forming component.

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Bibliographische Detailangaben
Hauptverfasser: Karikari, Afua Sarpong, Jin, Xin, Gulyas, Gyongyi, Mitchell, Michael C, Fitzgibbons, Thomas, Kao, Joseph, Kaga, An
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A sealing composition for use in unit dose packages is provided, including: 70 to 98 wt % water; 1 to 30 wt % of a hydrogen bonding component; and 1 to 30 wt % of a complex forming component.