Sealing compositions for water soluble films and methods of using
A sealing composition for use in unit dose packages is provided, including: 70 to 98 wt % water; 1 to 30 wt % of a hydrogen bonding component; and 1 to 30 wt % of a complex forming component.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A sealing composition for use in unit dose packages is provided, including: 70 to 98 wt % water; 1 to 30 wt % of a hydrogen bonding component; and 1 to 30 wt % of a complex forming component. |
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