Adhesive member, adhesion method, and method for manufacturing electronic device casing

An adhesive member includes: a first pin portion to be inserted into a first hole formed in a first adherend member; a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first p...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Watai, Atsuki, Kamiyama, Koji, Nagata, Kentaro, Yokomura, Nobuo
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An adhesive member includes: a first pin portion to be inserted into a first hole formed in a first adherend member; a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first pin portion; and a flange portion which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape.