Heat transfer roller apparatus and associated methods of use

A heat transfer roller apparatus is disclosed and configured for transferring an at least one design onto a substrate. In at least one embodiment, with the substrate sandwiched between a support frame and a support base of the apparatus, and a heat transfer compatible transfer sheet containing the at least one design positioned on the substrate within a frame boundary defined by the support frame, an at least one heat roller traverses across the transfer sheet-from a first end of the support frame to an opposing second end of the support frame-at a predetermined temperature, pressure and traversal time as set by a controller of the apparatus, so as to cause the at least one design on the transfer sheet to bond to the substrate, with a carrier of the apparatus subsequently separating the transfer sheet from the substrate while the transfer sheet is still hot.