Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging

An apparatus, comprising a substrate comprising a dielectric, a conductor, comprising a via embedded within the dielectric, the via has a first end and a second end, and substantially vertical sidewalls between the first end and the second end, and a conductive structure extending laterally from the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tanaka, Hiroki, Darmawikarta, Kristof, May, Robert A, Boyapati, Sri Ranga Sai
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!