Method for producing thin glass resin laminate piece

Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method...

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Bibliographische Detailangaben
Hauptverfasser:	Kishi, Atsushi, Hirata, Satoshi, Murashige, Takeshi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SOLDERING OR UNSOLDERING TRANSPORTING USE OF MATERIALS AS ADHESIVES WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (μm) of the pressure-sensitive adhesive layer and a creep characteristic (μm/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (μm))2×creep characteristic (μm/Hr)≥50×103 (μm2·μm/Hr).