Interconnect architecture with silicon interposer and EMIB

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coup...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Srinivasan, Sriram, Nalamalpu, Ankireddy, Gutala, Ravi, Hossain, Md Altaf, Mahajan, Ravindranath V, Dasu, Aravind, Sankman, Robert, Agarwal, Rajat, Subbareddy, Dheeraj, Sane, Sandeep B, Mallik, Debendra, Weber, Scott, Viswanath, Ram S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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