Interconnect architecture with silicon interposer and EMIB

Interconnect architecture with silicon interposer and EMIB

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coup...

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Bibliographische Detailangaben
Hauptverfasser: Srinivasan, Sriram, Nalamalpu, Ankireddy, Gutala, Ravi, Hossain, Md Altaf, Mahajan, Ravindranath V, Dasu, Aravind, Sankman, Robert, Agarwal, Rajat, Subbareddy, Dheeraj, Sane, Sandeep B, Mallik, Debendra, Weber, Scott, Viswanath, Ram S
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.