Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL

The disclosure concerns methods of forming a semiconductor device with a repairable redistribution layer (RDL) design, comprising: preparing an original repairable RDL design; forming first conductive segments of the repairable RDL design; inspecting the first conductive segments of the repairable R...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Bishop, Craig, Bartling, David Ryan, Olson, Timothy L
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The disclosure concerns methods of forming a semiconductor device with a repairable redistribution layer (RDL) design, comprising: preparing an original repairable RDL design; forming first conductive segments of the repairable RDL design; inspecting the first conductive segments of the repairable RDL design to detect manufacturing defects; detecting at least one defect in the first conductive segments; and forming second conductive segments of the repairable RDL design according to a new custom RDL design to mitigate the negative effects of the at least one defect among the first conductive segments. The disclosure also concerns semiconductor devices with a repairable RDL design.