Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same

Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same

The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline poly...

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Hauptverfasser: Park, Chun Ho, Yoon, Jin Young, Lee, Hee Joon, Cha, Dong Eun, Jeong, Seung Ryong, Chae, Jin Bo, Kwon, Sun Jun
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator Park, Chun Ho
Yoon, Jin Young
Lee, Hee Joon
Cha, Dong Eun
Jeong, Seung Ryong
Chae, Jin Bo
Kwon, Sun Jun
description The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
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